Perfectly cut silicon wafers: digiCLIP ensures leaps in efficiency for the production of photovoltaic systems

Perfectly matched

Continuous monitoring of this critical sawing process using modern measurement technology helps to avoid production errors and material loss early on. A measurement device from HBK has proven itself for this task; its components – a force transducer and the industrial digiCLIP amplifier – are perfectly matched.

The transducer records the force acting on the silicon by the saw wire. digiCLIP continuously acquires these force signals and transfers them directly via Profibus-DP to the production control. In addition to acquiring the basic measurement data, digiCLIP also initially evaluates the deviations from the nominal force – and also transmits these to the superordinate production control. Thanks to the high transmission speed of the Profibus interfaces, error messages are sent in just a few milliseconds.

If the contact force of the saw deviates from the reference value, the production control fully automatically corrects the parameters for drive and control of the saw machine. This interplay between continuous force monitoring, error evaluation and feedback channel ensures an efficient early warning system in the production of wafers – and protects against costs and material losses. The individual advantages:

1. Errors and operating problems during wafer sawing are detected more rapidly and can be corrected immediately.
2. The continuous feedback and ensuring of sawing force enables efficient handling of the silicon ingot – and therefore minimum material loss during production.
3. The quality of the finished wafers is significantly improved.

The perfectly matched components of this measurement chain in production ensures significant gains in efficiency for the production of wafers - and not just there. Wherever forces, torques or pressures need to be monitored, the industrial process monitoring systems from HBK provide reliable services for more safety and efficiency.